Packaging & Printed Circuit Design

Ardtech provides a wide range of packaging design services, working with metals or plastics or a combination of both to achieve the design requirements. Our mechanical engineering design service uses the latest in CAD tools and analytical simulation software. From simple plastic enclosed housings meeting minimal IPC requirements to fully hermetically sealed hybrid assemblies meeting the most stringent environmental and electrical requirements. Complementing our mechanical services is our circuit design and printed circuit layout capability, from schematic capture through to creating the physical component libraries to building circuit simulations along with 3D mechanical rendering of the target assembly.

Our mechanical CAD designer system is based on Solidworks and our EDN system is based on Altium Designer. These tools allow us to properly port between both systems 3D information thus supporting a high degree of accuracy resulting in much less errors at the conclusion. Altium Designer suffices to support activities with real time embedded code development in conjunction to FPGA development and circuit simulation. Schematic capture, circuit board design and manufacturing support including detailed Bills Of Materials round out the Altium base functions.

Our Packaging & Printed Circuit Design services include:

• Fully custom packaging designs,
  • Engineered plastic housings,
  • Die-cast alloys and metal stampings,
  • Hybrid metal and plastic housings,
  
  
• Printed Circuit designs,
• Single-sided, double-sided and multi-layer boards
• Thick film hybrid, (RF Circuits)
• Rigid and flexible circuits
• Surface mount, through-hole, mixed technology
• Design for manufacture (DFM)
• Design for testability (DFT)